2020-03-18 08:53:35 Editor:凯福
高精密对位平台
Only the brand "YARAK" high-precision alignment platform developed by the company's Taiwan technical team has been widely recommended and used on high-end equipment. Product specifications cover 150mm, 160mm, 180mm, 200mm, 250mm, 350mm, 450mm, 550mm, larger disk size we can customize according to requirements.
The XXY alignment platform, also known as the XYθ (Theta) platform or UVW alignment platform, is designed for high-precision alignment devices that move in the XY plane and rotate around the center of the XY plane. We offer eight conventional XXY alignment platforms with a repeatable positioning accuracy of 2μm for small sizes and 3μm for large sizes, with linear strokes of ± 5mm for these models and up to ±10mm for large sizes. In addition, the XXY platform can be rotated to ±3° around the center of the XY plane, with a horizontal load from 15KG to 100KG.
XXY counterpoint platform Features:
The size structure is diversified, XXY alignment platform has two kinds of hollow and solid design, which can meet the different design needs of users
The thin design saves space - the Mini stage XYθ modular construction enables a thin and light mechanism without a center seat
High rigidity and precision are achieved by applying prepressure through special cross roller bearings
Hollow structure design, can be used as optical inspection device or conduction tester
The lubrication system is added to each moving track to improve the service life and accuracy of the alignment platform
Materials are treated with ultra-deep cooling, effectively preventing deformation, greatly improving service life, quality and efficiency
High precision, high rigidity, stability guarantee, the implementation of three dimensional full inspection, to ensure the factory accuracy and quality of the slide
Can be mounted horizontally or upside-down
XXY alignment platform (uvw alignment platform), visual alignment platform is widely used in optical measuring instruments, wafer alignment, LCD panel inspection, semiconductor processing, laser cutting and drilling, composite machine and other fields.